Automatic Die Bonder-Shenzhen June’s Automation Co., Ltd._

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Automatic Die Bonder

MOQ ： piece

Lead Time ： Days

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Seller Support : Trade Authenticity Guaranteed & Accepting

Payment : L/C，T/T，Western Union, Money Gram, Credit Card, Paypal

Product details

Supply Ability

Warranty(Year)：1 Year

Product Specifications

Product Description

·Average Cycle Time: 450ms / cycle
·UPH：8K
·Wafer X/Y 行程：8"×8"
·Workholder X/Y 行程：10"×6"
·Die Placement Accuracy：±0.5mil
·Die Size：5mil-120mil
·Wafer Diameter: 6" /8"/10"
·Flexible and Changeable Collet Head
·Automatic Inspection System, Automatic Level Detection
·Intelligent PR System (iPR)
·LCD touch screen
·Bilingual Menu
·Power 2000W
·Diemention 1200 x 1000x 1500mm
·Weight 450kgs